A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection
This paper presents a novel on-wafer self-powered wireless sensing module for extreme ultraviolet (EUV) lithography, advancing prior designs through the integration of a Gate Voltage Controlled Oscillator (GVCO) and an optimized ultra-thick metal on-chip antenna (OCA) for enhanced stability and transmission properties. The surface sensing pad captures incident photons, inducing energy via a coupling device to control the GVCO, whose output frequency reflects real-time EUV intensity. The output frequency signal can be wirelessly transmitted to the receiver through an OCA. It enables real-time monitoring of on-wafer EUV exposure parameters in advanced lithography systems without an external power source, thereby facilitating the yield control of advanced CMOS processes.
Authors
- Jenny Yi-Chun Liu (ORCID: https://orcid.org/0000-0003-3540-880X)
- Pin‐Jiun Wu (ORCID: https://orcid.org/0000-0002-1445-8261)
- Ya‐Chin King (ORCID: https://orcid.org/0000-0003-4065-0350)
- Wei Chang (ORCID: https://orcid.org/0009-0004-7877-533X)
- Burn J. Lin (ORCID: https://orcid.org/0000-0003-1024-9515)
- Jiaw‐Ren Shih
- Chrong Jung Lin
- K. W. Yeh
Institutions
- National Tsing Hua University (TW)
- National Synchrotron Radiation Research Center (TW)
Publication Details
- Journal
- IEEE Transactions on Semiconductor Manufacturing
- Published
- 2025-09-01
- DOI
- https://doi.org/10.1109/tsm.2025.3604789
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Taiwan Semiconductor Manufacturing Company