Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection

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Publication Details

Journal
Journal of The Japan Institute of Electronics Packaging
Published
2025-08-31
DOI
https://doi.org/10.5104/jiep.28.564
Primary Topic
Industrial Vision Systems and Defect Detection
Type
article
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article

Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection

Koki Yanagida
Journal of The Japan Institute of Electronics Packaging
Industrial Vision Systems and Defect Detection
article

Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection

Koki Yanagida
article en

Abstract

No abstract available for this paper.
Journal of The Japan Institute of Electronics PackagingVol. 28(6)
Obayashi (Japan) (JP)
Openalex Percentile: Top 68%
Industrial Vision Systems and Defect Detection
DOISourceOpenAlex
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Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection — Koki Yanagida · Journal of The Japan Institute of Electronics Packaging (2025) | TGRS Research Map | TGRS