Thermal Performance Analysis and Structural Optimization of Main Functional Components of Computers

In today’s data-driven age, the thermal properties of computer transistors play an important role. In this research, finite element simulation is employed to construct the structural model of the primary components within a computer chassis, and the thermal performance is evaluated based on ambient temperature, thermal conductivity, and heat dissipation rate. By combining the particle swarm optimization algorithm with numerical simulation for joint simulation and structural optimization, the component layout was optimized to reduce the working temperature. The results show that when the background temperature, that is, the ambient temperature, rises from −20 °C to 60 °C, the maximum operating temperature of the computer is approximately 88 °C. The maximum temperature is mainly in the transistor core and the minimum temperature is in the intake grille, and the operating temperature of the optimized structure decreases by approximately 10 °C. The research shows that the operating temperature is most sensitive to the change of background temperature, and the transistor core is the main heating source. The maximum temperature can be reduced by rationally adjusting the position of the components. This study provides a reference for analyzing the thermal performance of computers and optimizing structures.