Microstructure and strengthening mechanism of diffusion bonding joints of 6063 aluminum alloy under the monomolecular surface protection of α-terpineol

6063 aluminum alloy is often used in the manufacture of microchannel heat exchangers, which are formed by diffusion bonding to connect laminates, and diffusion bonding is a key technology that determines the production quality. However, the Al 2 O 3 oxide film with a stable surface and high melting point obstructs the close contact and atomic diffusion of the surface to be bonded, causing problems in diffusion bonding. In order to solve this problem, we propose a novel eco-friendly strategy using α-terpineol for monomolecular surface protection. Its terminal hydroxyl groups form a self-assembled film, suppressing secondary oxidation and fracturing the stable Al 2 O 3 layer. The temperature of the diffusion bonding process is 570 °C, the pressure is 4 M Pa, and the time is 30∼120 min. The enrichment of Mg and Si enriched Mg 2 Si and O elements was observed at the joint interface. When the bonding temperature was 570 °C and the bonding time was 90 min, the joint tensile strength reached 128.3 M Pa and the elongation was 28.8 %. This work establishes α-terpineol as a sustainable, and provides theoretical basis and technical support for the diffusion bonding process of AA6063 aluminum alloy.

Authors

Institutions

Publication Details

Journal
Journal of Materials Research and Technology
Published
2025-08-29
DOI
https://doi.org/10.1016/j.jmrt.2025.08.151
Citations
1
Primary Topic
Aluminum Alloy Microstructure Properties
Type
article
Field-Weighted Citation Impact
4.99
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Microstructure and strengthening mechanism of diffusion bonding joints of 6063 aluminum alloy under the monomolecular surface protection of α-terpineol

Peng Yu, Jiangtao Xiong, Shiming Xu, Lichi Ma et al.
1 citations
Journal of Materials Research and Technology
Aluminum Alloy Microstructure Properties
4.99
article

Microstructure and strengthening mechanism of diffusion bonding joints of 6063 aluminum alloy under the monomolecular surface protection of α-terpineol

Peng Yu, Jiangtao Xiong, Shiming Xu, Lichi Ma, Jinglong Li, Jiafen Song
article en
1 citations

Abstract

6063 aluminum alloy is often used in the manufacture of microchannel heat exchangers, which are formed by diffusion bonding to connect laminates, and diffusion bonding is a key technology that determines the production quality. However, the Al 2 O 3 oxide film with a stable surface and high melting point obstructs the close contact and atomic diffusion of the surface to be bonded, causing problems in diffusion bonding. In order to solve this problem, we propose a novel eco-friendly strategy using α-terpineol for monomolecular surface protection. Its terminal hydroxyl groups form a self-assembled film, suppressing secondary oxidation and fracturing the stable Al 2 O 3 layer. The temperature of the diffusion bonding process is 570 °C, the pressure is 4 M Pa, and the time is 30∼120 min. The enrichment of Mg and Si enriched Mg 2 Si and O elements was observed at the joint interface. When the bonding temperature was 570 °C and the bonding time was 90 min, the joint tensile strength reached 128.3 M Pa and the elongation was 28.8 %. This work establishes α-terpineol as a sustainable, and provides theoretical basis and technical support for the diffusion bonding process of AA6063 aluminum alloy.

Journal of Materials Research and TechnologyVol. 38
Northwestern Polytechnical University (CN), China XD Group (China) (CN)
Openalex Percentile: Top 5%
Aluminum Alloy Microstructure Properties
4.99
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.