Silicon Recovery from End-of-Life Solar Modules Using High-Power Laser Processing

The rapid expansion of the solar industry has created an urgent need for efficient end-of-life photovoltaic (PV) module recycling to address environmental, reutilization of resources, and economic challenges. This study introduces a novel laser-based method for recovering intact silicon wafers from discarded silicon PV modules. By optimizing high-power pulsed laser parameters, focal beam size, power, and scanning speed, we achieved precise separation of silicon from PV modules containing encapsulant layers while preserving their structural integrity. The process began with backsheet removal through chemical treatment, followed by laser debonding at the silicon/ ethylene vinyl acetate (EVA) encapsulant interface. This approach successfully recovered the intact original silicon wafer of 5-inch x 5-inch size, free from residual carbonaceous particles, suitable for reuse in the semiconductor industry. The laser process is scalable and economical, allowing for large-scale applications. The recovered materials demonstrate strong potential to advance the circular economy within the photovoltaic sector. This innovative technique enhances the economic viability of PV module recycling while significantly reducing environmental impacts, aligning with global sustainability goals for renewable energy.