Multi-Isotopic Analysis for Robust Traceability of Crystalline Silicon Wafers

This work investigates tracking methods to authenticate the origin of crystalline silicon (c-Si) wafers used by the PV industry and to identify those from companies using forced labor during fabrication. Along these lines, the <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si/<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">28</sup>Si and the <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si/<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">28</sup>Si isotopic ratios (δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si and δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si, resp.) in c-Si wafers sourced from seven different suppliers worldwide were analyzed using highly sensitive and highly precise atomic mass spectrometry techniques, namely multi-collector inductively coupled plasma mass spectroscopy (MC-ICPMS) and femtosecond laser ablation ICPMS. The analysis of the sourced cSi wafers revealed a clear, unique (δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si, δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si) isotopic footprint for each manufacturer, with δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si (resp. δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si) spanning between ±1.50 ‰ (resp. ±1.00 ‰) and excellent R<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> values. Even if the root causes of the isotopic fractionation along the c-Si wafer production stream are still to be evidenced, these results open the way to a robust and unambiguous method to authenticate c-Si wafers. Applications and replications to other c-Si-based devices are foreseen, such as for chips and detectors, where the requests for supply chain transparency and traceability exist as well.

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Published
2025-06-08
DOI
https://doi.org/10.1109/pvsc59419.2025.11133388
Primary Topic
Recycling and Waste Management Techniques
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article

Multi-Isotopic Analysis for Robust Traceability of Crystalline Silicon Wafers

Julien Barré, Sylvain Bérail, Bertrand Paviet‐Salomon, Christophe Pécheyran
Recycling and Waste Management Techniques
article

Multi-Isotopic Analysis for Robust Traceability of Crystalline Silicon Wafers

Julien Barré, Sylvain Bérail, Bertrand Paviet‐Salomon, Christophe Pécheyran
article en

Abstract

This work investigates tracking methods to authenticate the origin of crystalline silicon (c-Si) wafers used by the PV industry and to identify those from companies using forced labor during fabrication. Along these lines, the <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si/<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">28</sup>Si and the <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si/<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">28</sup>Si isotopic ratios (δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si and δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si, resp.) in c-Si wafers sourced from seven different suppliers worldwide were analyzed using highly sensitive and highly precise atomic mass spectrometry techniques, namely multi-collector inductively coupled plasma mass spectroscopy (MC-ICPMS) and femtosecond laser ablation ICPMS. The analysis of the sourced cSi wafers revealed a clear, unique (δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si, δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si) isotopic footprint for each manufacturer, with δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">30</sup>Si (resp. δ<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">29</sup>Si) spanning between ±1.50 ‰ (resp. ±1.00 ‰) and excellent R<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> values. Even if the root causes of the isotopic fractionation along the c-Si wafer production stream are still to be evidenced, these results open the way to a robust and unambiguous method to authenticate c-Si wafers. Applications and replications to other c-Si-based devices are foreseen, such as for chips and detectors, where the requests for supply chain transparency and traceability exist as well.

Centre National de la Recherche Scientifique (FR), Swiss Center for Electronics and Microtechnology (Switzerland) (CH), Institut des Sciences Analytiques et de Physico-Chimie pour l'Environnement et les Matériaux (FR), Advanced Analysis Center (JP)
Openalex Percentile: Top 72%
Recycling and Waste Management Techniques
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