Facile fabrication of high-performance multi-functional ultrathin GAs films with high orientation

• Flexible ultra-thin graphene aggregates-pressed films with high-orientation are obtained by simply unidirectional compression of the graphene aggregates foams. • The 48.7 µm-thick ultra-thin graphene aggregates-pressed film exhibits outstanding conductivity of 5.349 × 10 5 S/m and excellent EMI shielding performance of up to 106.2 dB • The Joule heating temperature of the graphene aggregates-pressed film is up to 256.70°C at a extremely low driving voltage of 1.7 V. • The low infrared emissivity of 0.284 in the 8–12 μm band endows this graphene aggregates-film with excellent infrared stealth performance. Highly oriented multifunctional graphene films show great application prospects in fields of electrical conduction, EMI shielding, electric heating, thermal management and infrared stealth, etc. However, the complex preparation steps and high cost greatly hinder their large-scale practical application. In this work, a pioneering but simple method for the low-cost preparation of high-performance multifunctional flexible graphene aggregates (GAs)-pressed films with high orientation has been proposed. By constructing the GAs orientedly arranged foams and then conducting mechanical compression in one direction, the GAs pressed films with excellent flexibility and high orientation have been successfully fabricated. In particular, for the resultant 48.7 µm-thick GAs pressed film, its electrical conductivity and EMI SE value is up to 5.349 × 10 5 S/m and 106.2 dB, respectively; the Joule heating temperature is up to 256.70°C at a extremely low driving voltage of 1.7 V; the in-plane thermal conductivity is 768.2 W·m −1 ·K −1 and the infrared emissivity is very low (0.388 at 3–5 μm; 0.284 at 8–12 μm), enabling excellent infrared stealth performance. Therefore, this flexible ultra-thin GAs pressed film will be of great promise as a multi-functional film due to its excellent performance in terms of electrical conduction, EMI shielding, electric heating, thermal management and infrared stealth.