THE EFFECT OF SUBSTRATE ROUGHNESS ON THE MORPHOLOGY AND ADHESIVE STRENGTH OF YSZ COATINGS DEPOSITED WITH A FORE VACUUM PLASMA-CATHODE ELECTRON SOURCE

We present the experimental results on electron-beam deposition of Y<sub>2</sub>O<sub>3</sub>-stabilized zirconium dioxide ceramic coatings using a fore vacuum plasma-cathode electron source. The influence of the substrate roughness on the structure and roughness of the coating was evaluated. It was found that, at the roughness of the substrate Ra 1.96-0.21 microns, the coatings have the best adhesive properties. Coatings are subject to destruction due to inelastic deformation and mechanical coupling with the substrate.

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Publication Details

Journal
High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes
Published
2025-08-29
DOI
https://doi.org/10.1615/hightempmatproc.2025058338
Primary Topic
Metal and Thin Film Mechanics
Type
article
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article

THE EFFECT OF SUBSTRATE ROUGHNESS ON THE MORPHOLOGY AND ADHESIVE STRENGTH OF YSZ COATINGS DEPOSITED WITH A FORE VACUUM PLASMA-CATHODE ELECTRON SOURCE

Denis B. Zolotukhin, A.V. Tyunkov, A. A. Andronov, Yu. G. Yushkov et al.
High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes
Metal and Thin Film Mechanics
article

THE EFFECT OF SUBSTRATE ROUGHNESS ON THE MORPHOLOGY AND ADHESIVE STRENGTH OF YSZ COATINGS DEPOSITED WITH A FORE VACUUM PLASMA-CATHODE ELECTRON SOURCE

Denis B. Zolotukhin, A.V. Tyunkov, A. A. Andronov, Yu. G. Yushkov, Stanislav Maisner
article en

Abstract

We present the experimental results on electron-beam deposition of Y<sub>2</sub>O<sub>3</sub>-stabilized zirconium dioxide ceramic coatings using a fore vacuum plasma-cathode electron source. The influence of the substrate roughness on the structure and roughness of the coating was evaluated. It was found that, at the roughness of the substrate Ra 1.96-0.21 microns, the coatings have the best adhesive properties. Coatings are subject to destruction due to inelastic deformation and mechanical coupling with the substrate.

High Temperature Material Processes An International Quarterly of High-Technology Plasma ProcessesVol. 30(1)
Tomsk State University of Control Systems and Radio-Electronics (RU)
Openalex Percentile: Top 74%
Metal and Thin Film Mechanics
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