A Low‐Profile and Low‐Noise 4 × 4 Tile‐Type K‐Band Receive Module Using 3D Stacked LTCC Technology

ABSTRACT This paper presents a low‐profile K‐band 4 × 4 tile‐type receive module utilizing low temperature co‐fired ceramic (LTCC) technology, achieving per‐channel noise figure (NF) below 1.8 dB. The module architecture comprises a metallic shell, an LTCC components, a bottom cover plate, and four metallic fasteners. Three‐dimensional monolithic integration is achieved through stacked circuitry, advanced processing, and fuzz button interconnects. Critical NF optimization (< 1.8 dB) results from co‐designed LNA layer topology and fuzz button connector interfaces. Fabrication and testing demonstrate > 11.5 dB return loss, > 18.2 dB channel gain, < ± 8.5 phase error across 16 channels, < 1.8 dB NF, 8 mm profile height, and 1.18 g per‐channel mass. This design enables scalable low‐profile phased arrays with high G/T for satellite communication systems.