Crack Development of Electroplated NiW Alloys and their Wettability and Tribological properties
This study investigates how sodium tungstate concentration (20–46 wt.%) and current density (40–60 A/dm²) affect the microstructure, wettability, mechanical properties, and tribological behavior of electrodeposited Ni-W coatings. Results show that increasing current density markedly raises crack density (from <100 to >400 cracks/cm²), while tungstate concentration has minimal effect. XRD confirms Ni-W solid solution formation, with higher tungsten content refining grains and increasing hardness—peaking at 900 HV at 50 A/dm² (an 80% rise from 500 HV at 40 A/dm²). However, excessive stress at 60 A/dm² leads to microcracking and hardness plateauing (~650–700 HV). Higher crack density improves wettability (contact angle ~17°), enhancing lubricant retention. Wear tests reveal that coatings with controlled microcrack networks perform better, with wear rates dropping by up to 60% in lubricated conditions. These findings highlight the potential of fine-tuning electroplating conditions to optimize Ni-W coatings as durable, high-performance, and environmentally friendly alternatives to chromium coatings, especially for aerospace, automotive, and industrial applications.
Authors
- Petch Jearanaisilawong (ORCID: https://orcid.org/0000-0001-6556-7612)
- Martin Metzner (ORCID: https://orcid.org/0000-0003-0338-1753)
- Jidsucha Darayen
- Suwat Ploypech (ORCID: https://orcid.org/0000-0002-3265-4418)
- Claudia Beatriz dos Santos
- Yuttanant Boonyongmaneerat
Institutions
- Thammasat University (TH)
- Chulalongkorn University (TH)
- Fraunhofer Institute for Manufacturing Engineering and Automation (DE)
- King Mongkut's University of Technology North Bangkok (TH)
Publication Details
- Journal
- Journal of Metals Materials and Minerals
- Published
- 2025-08-28
- DOI
- https://doi.org/10.55713/jmmm.v35i4.2376
- Citations
- 2
- Primary Topic
- Electrodeposition and Electroless Coatings
- Type
- article
- Field-Weighted Citation Impact
- 1.46
Funders
- Bundesministerium für Bildung und Forschung
- Chulalongkorn University