BEOL-Compatible Annealing-Free Hf<sub>x</sub>Zr<sub>1-x</sub>O<sub>2</sub> Ferroelectric Device and Investigation of Cycle-Dependent Evolution Mechanisms

This work focuses on the performance optimization and cycle-dependent evolution mechanisms of low-temperature anneal-free hafnium-based ferroelectric devices. By modulating oxygen plasma power, effective synthesis of ferroelectric o-phase was achieved at processing temperatures <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\le$</tex-math></inline-formula>280 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∘</sup>C without the need for additional annealing process, compatible with CMOS back-end-of-line (BEOL) technology. The Hf<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>x</roman></sub>Zr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>1</roman>-<i>x</i></sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub> (HZO) film fabricated at 50-W power demonstrates a remarkable 2Pr of 50 μC/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sup> and can withstand 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>10</roman></sup> polarization cycles without dielectric breakdown, exhibiting the best overall performance. Through combined macroscopic electrical characterization and microscopic polarization switching dynamics analysis, this work reveals a cycle-dependent evolution mechanism of ferroelectric properties and proposes a defect dynamic evolution model for anneal-free films. These results establish a foundational framework for designing next-generation embedded ferroelectric memories with low-temperature compatibility and ultrahigh reliability.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-08-28
DOI
https://doi.org/10.1109/ted.2025.3601559
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

BEOL-Compatible Annealing-Free HfxZr1-xO2 Ferroelectric Device and Investigation of Cycle-Dependent Evolution Mechanisms

Jiajie Yu, Hao Zhu, Anna Yuan, Zhenhai Li et al.
IEEE Transactions on Electron Devices
Ferroelectric and Negative Capacitance Devices
article

BEOL-Compatible Annealing-Free HfxZr1-xO2 Ferroelectric Device and Investigation of Cycle-Dependent Evolution Mechanisms

Jiajie Yu, Hao Zhu, Anna Yuan, Zhenhai Li, Pei Liu, David Wei Zhang, Chen Wang, Tianyu Wang, Qingqing Sun, Lin Chen, Ze Xu, Jialin Meng, Yongkai Liu, Kangli Xu, Yifan Song, Ruihong Yuan
article en

Abstract

This work focuses on the performance optimization and cycle-dependent evolution mechanisms of low-temperature anneal-free hafnium-based ferroelectric devices. By modulating oxygen plasma power, effective synthesis of ferroelectric o-phase was achieved at processing temperatures <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\le$</tex-math></inline-formula>280 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">∘</sup>C without the need for additional annealing process, compatible with CMOS back-end-of-line (BEOL) technology. The Hf<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>x</roman></sub>Zr<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>1</roman>-<i>x</i></sub>O<sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sub> (HZO) film fabricated at 50-W power demonstrates a remarkable 2Pr of 50 μC/cm<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>2</roman></sup> and can withstand 10<sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><roman>10</roman></sup> polarization cycles without dielectric breakdown, exhibiting the best overall performance. Through combined macroscopic electrical characterization and microscopic polarization switching dynamics analysis, this work reveals a cycle-dependent evolution mechanism of ferroelectric properties and proposes a defect dynamic evolution model for anneal-free films. These results establish a foundational framework for designing next-generation embedded ferroelectric memories with low-temperature compatibility and ultrahigh reliability.

IEEE Transactions on Electron DevicesVol. 72(10)
Anhui University (CN), Shandong University (CN), Fudan University (CN), Shanghai Fudan Microelectronics (China) (CN)
National Natural Science Foundation of China, Natural Science Foundation of Shandong Province, Taishan Scholar Foundation of Shandong Province, National Key Research and Development Program of China
Openalex Percentile: Top 78%
Ferroelectric and Negative Capacitance Devices
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