Design of a High-Power, High-Efficiency GaN Power Amplifier for W-Band Applications

This paper presents a W-band high-efficiency and high-output-power power amplifier (PA) based on a 130 nm AlGaN/GaN-on-SiC HEMT process. The PA is designed to deliver optimal output power and gain performance across the entire W-band. A balanced architecture is adopted, combining two amplifier units through Lange couplers. High- and low-impedance microstrip lines are employed for input, output, and inter-stage matching. Each amplifier core adopts a three-stage configuration with gate width ratios of 1:2:4 to enhance gain. The bias network incorporates MIM capacitors and thin-film resistors to improve stability. Measured results indicate a small signal gain exceeding 17 dB under a gate voltage of -2.2 V and a drain voltage of +20 V. Within the 80-86 GHz frequency range, the PA achieves an output power above 34 dBm with a 22 dBm input power, corresponding to a power gain above 12 dB and a power-added efficiency (PAE) greater than 20%. The chip occupies a compact area of 2.65 mm × 3.75 mm. Compared with previously reported works, the proposed PA demonstrates the highest PAE within the 80-86 GHz band.

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Publication Details

Journal
Micromachines
Published
2025-08-28
DOI
https://doi.org/10.3390/mi16090985
Citations
1
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
1.26
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article

Design of a High-Power, High-Efficiency GaN Power Amplifier for W-Band Applications

Shuai Liu, Chunliang Xu, Xiaohua Ma, Yi Zhang
1 citations
Micromachines
GaN-based semiconductor devices and materials
1.26
article

Design of a High-Power, High-Efficiency GaN Power Amplifier for W-Band Applications

Shuai Liu, Chunliang Xu, Xiaohua Ma, Yi Zhang
article en
1 citations

Abstract

This paper presents a W-band high-efficiency and high-output-power power amplifier (PA) based on a 130 nm AlGaN/GaN-on-SiC HEMT process. The PA is designed to deliver optimal output power and gain performance across the entire W-band. A balanced architecture is adopted, combining two amplifier units through Lange couplers. High- and low-impedance microstrip lines are employed for input, output, and inter-stage matching. Each amplifier core adopts a three-stage configuration with gate width ratios of 1:2:4 to enhance gain. The bias network incorporates MIM capacitors and thin-film resistors to improve stability. Measured results indicate a small signal gain exceeding 17 dB under a gate voltage of -2.2 V and a drain voltage of +20 V. Within the 80-86 GHz frequency range, the PA achieves an output power above 34 dBm with a 22 dBm input power, corresponding to a power gain above 12 dB and a power-added efficiency (PAE) greater than 20%. The chip occupies a compact area of 2.65 mm × 3.75 mm. Compared with previously reported works, the proposed PA demonstrates the highest PAE within the 80-86 GHz band.

MicromachinesVol. 16(9)
Xidian University (CN), China Electronics Technology Group Corporation (CN)
Openalex Percentile: Top 18%
GaN-based semiconductor devices and materials
1.26
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Design of a High-Power, High-Efficiency GaN Power Amplifier for W-Band Applications — Shuai Liu, Chunliang Xu, et al. · Micromachines (2025) | TGRS Research Map | TGRS