Novel Dichloronaphthalene Diamine‐Based Curing Agent for Epoxy Resins: Synthesis, Properties, and Preliminary Applications

ABSTRACT A high‐purity (98.5%) naphthylamine‐based curing agent, 2,6‐dichloronaphthalene‐1,5‐diamine (DCNDA), was successfully synthesized through the electrophilic substitution reaction of 1,5‐naphthalene diamine with N‐chlorosuccinimide. When combined with AFG‐90MH resin, the resulting DCNDA‐cured system displays favorable curing characteristics with a broad processing window and an extensive curing temperature range. After a two‐stage process: 150°C for 2 h followed by 180°C for 2 h, the cured resin exhibits outstanding thermal stability, with a glass transition temperature ( T g ) reaching 150°C and a 5% weight loss decomposition temperature ( T d5 ) of 254°C, demonstrating its potential for high‐performance applications.

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Publication Details

Journal
Journal of Applied Polymer Science
Published
2025-08-27
DOI
https://doi.org/10.1002/app.57898
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.00

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article

Novel Dichloronaphthalene Diamine‐Based Curing Agent for Epoxy Resins: Synthesis, Properties, and Preliminary Applications

Pei‐Hua Zhao, Feng Yu, Ling‐Yan Chen, Farong Huang et al.
Journal of Applied Polymer Science
Epoxy Resin Curing Processes
article

Novel Dichloronaphthalene Diamine‐Based Curing Agent for Epoxy Resins: Synthesis, Properties, and Preliminary Applications

Pei‐Hua Zhao, Feng Yu, Ling‐Yan Chen, Farong Huang, Liqiang Wan, Chen‐Xin Bao
article en

Abstract

ABSTRACT A high‐purity (98.5%) naphthylamine‐based curing agent, 2,6‐dichloronaphthalene‐1,5‐diamine (DCNDA), was successfully synthesized through the electrophilic substitution reaction of 1,5‐naphthalene diamine with N‐chlorosuccinimide. When combined with AFG‐90MH resin, the resulting DCNDA‐cured system displays favorable curing characteristics with a broad processing window and an extensive curing temperature range. After a two‐stage process: 150°C for 2 h followed by 180°C for 2 h, the cured resin exhibits outstanding thermal stability, with a glass transition temperature ( T g ) reaching 150°C and a 5% weight loss decomposition temperature ( T d5 ) of 254°C, demonstrating its potential for high‐performance applications.

Journal of Applied Polymer ScienceVol. 142(48)
Shanghai University of Engineering Science (CN), East China University of Science and Technology (CN)
National Key Research and Development Program of China
Openalex Percentile: Top 77%
Epoxy Resin Curing Processes
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