Amino‐Functionalized Epoxy Resin With Enhanced Adhesion for Bonding Polyamide 6 Board and Polypropylene Film by Regulate Polarity and Forming Hydrogen Bonds

ABSTRACT Epoxy adhesive is becoming increasingly widely used in industry and daily life. There are many requirements to adhere to high and low polar interfaces simultaneously. In this work, a high polar epoxy resin, N , N ‐bis(4‐(oxiran‐2‐ylmethoxy) phenyl) adipamide (BOYPA), was designed and prepared. The relationship between the curing temperature and the curing time and the curing reaction kinetics equations of BOYPA and Bisphenol A diglycidyl ether (DGEBA) with diethylenetriamine (DETA) was clarified by the study of the curing kinetics according to the Kissinger equation and the Crane equation. Compared with DGEBA, BOYPA required higher curing activation energy and had a lower curing reaction rate. The curing reaction of BOYPA and DGEBA was both a simple curing reaction. Moreover, the peel strength between the PP film and PA6 board bonded by the mixture of BOYPA and DGEBA could be obviously enhanced with the increase of BOYPA content due to the proper polarity and the formation of hydrogen bonds. Meanwhile, the impact strength of the mixture of BOYPA and DGEBA was significantly improved because of the good toughness of BOYPA. As a result, this work provided a simple method for regulating the bonding properties of epoxy adhesive for different adherent surfaces.