Silent Data Corruption by 10× Test Escapes Threatens Reliable Computing

Too many defective compute chips are escaping today’s manufacturing tests – at least an order of magnitude more than industrial targets across all compute chip types in data centers. Silent data corruptions (SDCs) caused by test escapes, when left unaddressed, pose a major threat to reliable computing. We present a three-pronged approach outlining future directions for overcoming test escapes: (a) Quick diagnosis of defective chips directly from system-level incorrect behaviors. Such diagnosis is critical for gaining insights into why so many defective chips escape existing manufacturing testing. (b) In-field detection of defective chips. (c) New test experiments to understand the effectiveness of new techniques for detecting defective chips. These experiments must overcome the drawbacks and pitfalls of previous industrial test experiments and case studies.

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Publication Details

Journal
IEEE Design and Test
Published
2025-08-26
DOI
https://doi.org/10.1109/mdat.2025.3602741
Citations
2
Primary Topic
Big Data and Business Intelligence
Type
article
Field-Weighted Citation Impact
4.57
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Silent Data Corruption by 10× Test Escapes Threatens Reliable Computing

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article

Silent Data Corruption by 10× Test Escapes Threatens Reliable Computing

Rama Govindaraju, Parthasarathy Ranganathan, B. Parthasarathy, Eric X. Liu, Subho S. Banerjee, Subhasish Mitra, Peter Hochschild, Martin Dixon, Mike Fuller
article en
2 citations

Abstract

Too many defective compute chips are escaping today’s manufacturing tests – at least an order of magnitude more than industrial targets across all compute chip types in data centers. Silent data corruptions (SDCs) caused by test escapes, when left unaddressed, pose a major threat to reliable computing. We present a three-pronged approach outlining future directions for overcoming test escapes: (a) Quick diagnosis of defective chips directly from system-level incorrect behaviors. Such diagnosis is critical for gaining insights into why so many defective chips escape existing manufacturing testing. (b) In-field detection of defective chips. (c) New test experiments to understand the effectiveness of new techniques for detecting defective chips. These experiments must overcome the drawbacks and pitfalls of previous industrial test experiments and case studies.

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Silent Data Corruption by 10× Test Escapes Threatens Reliable Computing — Rama Govindaraju, Parthasarathy Ranganathan, et al. · IEEE Design and Test (2025) | TGRS Research Map | TGRS