Numerical Simulation and Experimental Verification of the Influence of Channel Structure on Multiphase Heat and Mass Transfer in Chip Cooling

With the continuous improvement of chip integration and power density, traditional air cooling technology has struggled to meet the heat dissipation requirements in high heat flux density scenarios. This study investigates the influence of channel structures on multiphase heat and mass transfer in chip cooling. A three-dimensional simulation model of an IGBT module and its cooling channel was established. Numerical simulations of heat and mass transfer characteristics for rectangular, trapezoidal, and circular cross-section channel structures were conducted using ANSYS FLUENT software. An experimental platform was also built to verify the heat dissipation performance. The results show that under the same cross-sectional area and flow velocity, the maximum temperature on the heat source surface of the circular cross-section microchannel is significantly lower than that of the rectangular and trapezoidal cross-sections, with reductions of 3.8–5.3 °C and 2.2–2.9 °C, respectively. Its Nusselt number (11.63) is also significantly higher than that of the rectangular (8.58) and trapezoidal (8.90) sections, indicating the strongest convective heat transfer capability. The circular cross-section enhances heat transfer due to more uniform fluid distribution and thinner boundary layers, but its processing difficulty and flow resistance need to be balanced. The heat transfer performance of trapezoidal and rectangular sections is similar, but the rectangular section is more easily implemented in engineering applications due to its simple structure. This study provides a theoretical basis and practical reference for the optimized design of high-power density chip radiators.