Microstructure, mechanical performance, electrical conductivity, and wear resistance of Cu–Fe composites processed via deformation-driven metallurgy

Cu–Fe composites containing 4 wt.% Fe were fabricated via deformation-driven metallurgy (DDM) at a constant rotational speed of 800 rpm with processing times of 5, 10, 15, and 20 s. The 5 s sample failed to consolidate, whereas the 10–20 s specimens exhibited fully bonded, equiaxed microstructures. Average grain size increased with time, from 6.9±1.7 μm (10 s) to 12.2±1.3 μm (20 s), compared to 15.1±1.5 μm for unreinforced Cu. Particle distribution uniformity declined with time, with coefficients of 0.85, 0.65, and 0.57 for 10, 15, and 20 s, respectively. Mechanical testing showed decreasing hardness from 158.5±3.8 HV (10 s) to 125.8±4.1 HV (20 s), alongside reduced ultimate tensile strength from 331.9±9.9 MPa to 296.1±9.8 MPa. Conversely, elongation increased from 19.2±1.5 % (10 s) to 30.5±2.1 % (20 s). Wear resistance followed hardness trends; the 10 s sample exhibited the highest resistance dominated by abrasive wear, while longer times led to adhesive wear and higher material loss. Electrical conductivity decreased with increasing time, from 94.3±0.2 %IACS (10 s) to 89.4±0.3 %IACS (20 s), compared to 96.8±0.3 %IACS for unreinforced Cu at 10 s.