Current-Voltage Modeling of 3D-NAND String Using Genetic Algorithm

This study presents a modeling approach for the current-voltage (I-V) characteristics of 3D-NAND flash memory using the BSIM-CMG (GEOMOD=3) transistor model combined with a genetic algorithm-based parameter optimization technique. Reference data were extracted from technology computer-aided design (TCAD) simulations for structures with one, three, and five word-line (WL) layers, and these data were utilized to optimize the parameters of the BSIM-CMG model. The results demonstrate that the I-V characteristics of 3D-NAND strings with up to 500 layers can be effectively represented, capturing variations in the I-V curves depending on the WL position on both linear and logarithmic scales. Furthermore, the current-voltage characteristics of tapered channel hole structures were successfully modeled. This work provides a robust framework for accurately simulating the electrical behavior of advanced 3D-NAND flash memory devices.

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Publication Details

Journal
JSTS Journal of Semiconductor Technology and Science
Published
2025-08-26
DOI
https://doi.org/10.5573/jsts.2025.25.4.420
Citations
1
Primary Topic
Internet of Things and Social Network Interactions
Type
article
Field-Weighted Citation Impact
1.49
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Current-Voltage Modeling of 3D-NAND String Using Genetic Algorithm

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Current-Voltage Modeling of 3D-NAND String Using Genetic Algorithm

Jung-Nam Kim, J.B. Park, Suk‐Kang Sung, Gihong Park, Yoon Kim, Garam Kim
article en
1 citations

Abstract

This study presents a modeling approach for the current-voltage (I-V) characteristics of 3D-NAND flash memory using the BSIM-CMG (GEOMOD=3) transistor model combined with a genetic algorithm-based parameter optimization technique. Reference data were extracted from technology computer-aided design (TCAD) simulations for structures with one, three, and five word-line (WL) layers, and these data were utilized to optimize the parameters of the BSIM-CMG model. The results demonstrate that the I-V characteristics of 3D-NAND strings with up to 500 layers can be effectively represented, capturing variations in the I-V curves depending on the WL position on both linear and logarithmic scales. Furthermore, the current-voltage characteristics of tapered channel hole structures were successfully modeled. This work provides a robust framework for accurately simulating the electrical behavior of advanced 3D-NAND flash memory devices.

JSTS Journal of Semiconductor Technology and ScienceVol. 25(4)
Affordable and clean energy
Openalex Percentile: Top 14%
Internet of Things and Social Network Interactions
1.49
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