Study on the Thermal and Dielectric Properties of Magnetically Oriented $\text{Fe}_{3} \mathrm{O}_{4} {@} \text{SiC}_\mathrm{W}$/Liquid Crystal Epoxy Resin Composites

High-performance thermally conductive materials play a critical role in efficiently managing the heat generated by electronic devices during operation. The development of electronic packaging materials with superior thermal conductivity has emerged as a significant research focus. In this study, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Fe}_{3} \mathrm{O}_{4}$</tex> nanoparticles were uniformly deposited onto the surface of silicon carbide whiskers (SiCw) via chemical deposition, thereby enhancing the filler's thermal conductivity and imparting magnetic responsiveness. Subsequently, <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Fe}_{3} \mathrm{O}_{4} {@} \text{SiC}_{w}$</tex>/liquid crystal epoxy resin (LCER-E51) composites were fabricated using LCER-E51 as the matrix material. At a filler loading of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$8 \text{wt} \%$</tex>, the thermal conductivity of the composite treated under a magnetic field increased by 19.8 % relative to the LCER-E51 matrix and by 120.9 % compared to pure epoxy resin. Furthermore, this investigation revealed that the incorporation of <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$\text{Fe}_{3} \mathrm{O}_{4} {@} \text{SiCw}$</tex> fillers not only augmented the thermal conductivity of the composites but also diminished their dielectric loss at high frequencies, thereby improving electrical insulation properties for high-frequency applications.