Enabling Micro Transfer Printable SNSPDs for Fully Integrated Quantum Photonic Platforms
Micro-transfer printing (uTP) facilitates the integration of pre-characterized components from different substrates onto one common carrier die, enabling high-yield processes. Its highly parallel nature allows for exceptional throughput [1]. uTP has been successfully applied to III-V amplifiers, lasers [2], and quantum dot emitters [3], among others.
Authors
- Wolfram H. P. Pernice (ORCID: https://orcid.org/0000-0003-4569-4213)
- Isaac Luntadila Lufungula (ORCID: https://orcid.org/0000-0002-3418-1829)
- Linus Krämer
- Roland Jaha
- Connor A. Graham-Scott
- Simone Ferrari (ORCID: https://orcid.org/0000-0001-9341-4509)
- Lin Jin (ORCID: https://orcid.org/0000-0002-1464-3715)
Institutions
- University of Ulster (GB)
- Heidelberg University (DE)
- Ghent University Hospital (BE)
- Ghent University (BE)
- iMinds (BE)
- Heidelberg University of Education (DE)
- Heidelberg University (US)
- Delft University of Technology (NL)
Publication Details
- Published
- 2025-06-23
- DOI
- https://doi.org/10.1109/cleo/europe-eqec65582.2025.11111507
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00