Physical Machining of Chambers, Vias, and Monolithic Mirrors in Silicon for Quantum Technologies

Components for quantum technologies (QT) often leverage fabrication techniques from the sophisticated field of semiconductor processing, including near-perfect substrate wafers, cleanroom infrastructure, and nanometre-scale lithography and deposition. However, many components such as atom/ion traps used in quantum clocks and sensing, superconducting devices, and nonlinear optical components frequently require 3-dimensional structures with a complex combination of centimeter-length scales, sub-micron precision, and nanometer roughness that is difficult to achieve with standard semiconductor tools. These applications require the development of novel, scalable manufacturing techniques to become commercially viable.