Low-Footprint Fiber-Coupled InGaAs/InP Single-Photon Avalanche Diode Butterfly Module

Compact single-photon detectors are essential components for field-deployable quantum technology systems, such as fiber-based quantum key distribution (QKD) receivers or time-of-flight sensors for ranging applications. In contrast to cryogenic superconducting nanowires, InGaAs/InP semiconductor-based single-photon avalanche diodes (SPADs) have significant advantages in terms of size, weight, power, and cost (SWaP-C) as they are only moderately cooled by thermoelectric coolers (TECs). In addition, the non-cryogenic temperatures provide a better reliability of the device and allow its use in non-academic applications. We present a significantly improved chip generation compared to previous results [1], [2] with a system application oriented housing (fiber in-plane with PCB), by packaging the chip in a hermetic butterfly housing with fiber-pigtail and integrated TEC for cryo-free operation at temperatures down to −50°C, see Fig. 1.

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Published
2025-06-23
DOI
https://doi.org/10.1109/cleo/europe-eqec65582.2025.11110925
Primary Topic
Advanced Optical Sensing Technologies
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article
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article

Low-Footprint Fiber-Coupled InGaAs/InP Single-Photon Avalanche Diode Butterfly Module

Tino Petsch, Patrick Runge, Pascal Rustige, Eddy Collin et al.
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Advanced Optical Sensing Technologies
article

Low-Footprint Fiber-Coupled InGaAs/InP Single-Photon Avalanche Diode Butterfly Module

Tino Petsch, Patrick Runge, Pascal Rustige, Eddy Collin, Martin Schell
article en

Abstract

Compact single-photon detectors are essential components for field-deployable quantum technology systems, such as fiber-based quantum key distribution (QKD) receivers or time-of-flight sensors for ranging applications. In contrast to cryogenic superconducting nanowires, InGaAs/InP semiconductor-based single-photon avalanche diodes (SPADs) have significant advantages in terms of size, weight, power, and cost (SWaP-C) as they are only moderately cooled by thermoelectric coolers (TECs). In addition, the non-cryogenic temperatures provide a better reliability of the device and allow its use in non-academic applications. We present a significantly improved chip generation compared to previous results [1], [2] with a system application oriented housing (fiber in-plane with PCB), by packaging the chip in a hermetic butterfly housing with fiber-pigtail and integrated TEC for cryo-free operation at temperatures down to −50°C, see Fig. 1.

Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute (DE)
Affordable and clean energy
Openalex Percentile: Top 78%
Advanced Optical Sensing Technologies
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Low-Footprint Fiber-Coupled InGaAs/InP Single-Photon Avalanche Diode Butterfly Module — Tino Petsch, Patrick Runge, et al. · (2025) | TGRS Research Map | TGRS