Ultra Broadband and Super Low-Loss Plug-and-Play Fiber to PIC Connector
Integrated photonics represents a transformative platform for advancing classical and quantum technologies, enabling innovations in fields such as sensing, quantum systems, neuromorphic computing, and optical communication. These technologies benefit from the inherent advantages of integrated photonics, including high data throughput, low latency, and energy efficiency. However, the development of robust packaging solutions for photonic integrated circuits (PICs) remains a critical bottleneck, with efficient optical coupling being essential for minimizing losses and maximizing bandwidth [1]. Out-of-plane polymer couplers emerge as a compelling solution, offering low loss, high bandwidth, and compatibility with scalable fabrication techniques [2], [3].
Authors
- Clara Vazquez‐Martel (ORCID: https://orcid.org/0000-0002-4656-6056)
- Wolfram H. P. Pernice (ORCID: https://orcid.org/0000-0003-4569-4213)
- Erik Jung (ORCID: https://orcid.org/0000-0001-6172-6532)
- Eva Blasco (ORCID: https://orcid.org/0000-0002-0849-4223)
- Frank Brückerhoff‐Plückelmann (ORCID: https://orcid.org/0009-0006-5748-7069)
- Helge Gehring (ORCID: https://orcid.org/0000-0002-3034-3528)
Institutions
- Heidelberg University (DE)
- New Leaf Center (US)
Publication Details
- Published
- 2025-06-23
- DOI
- https://doi.org/10.1109/cleo/europe-eqec65582.2025.11111179
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00