The Effect of a Thermally Conductive Resin on Heat Dissipation When Applied in a Thin Film

The trend towards higher power density motors and electronics has resulted in manufacturers looking for more efficient ways to cool their products during operation. Due to the size of these components and the need to keep them light weight, polymer solutions for heat dissipation have been growing in popularity. Polymers are already present in these designs due to their ability to protect from environmental hazards, function as an adhesive, and provide electrical insulation. These same polymers can be modified to be thermally conductive through the addition of various fillers. However, the effects of thermally conductive resins when used in a thin film are still unclear. In this study, the thermal conductivity of an epoxy-based system with traditional silicas vs high performance alumina-based fillers at various loading levels were measured. These thermally conductive resins were then coated as a thin film onto copper magnet wire windings using a dip method. An electrical current was then applied to the windings and the dissipation of heat was observed using an infrared camera. The data obtained from observing the heat removed from the windings when under load was used to determine the thin film effects of thermally conductive polymers.