Effects of grinding parameters on the grinding performances of porous Cu–Sn–Ti diamond tools under dry condition

Currently, the grinding performance of porous metal-bonded diamond tools under liquid-cooled conditions has been extensively studied, but their grinding performance and wear mechanisms under dry conditions remain insufficiently explored. In this work, porous Cu-Sn-Ti diamond tools were used to grinding YSZ ceramics under dry conditions. And the effects of grinding parameters including grinding load, grinding speed, and grinding time on the tool’s surface morphology, material removal rate (MRR), grinding ratio (G), and YSZ surface roughness (SR) were systematically investigated. The results indicated that during the dry grinding process, as the grinding loads increase, the attrition degree of diamond grits in the porous Cu-Sn-Ti tools gradually increase. With the increase of grinding loads, the inhibitory effect of pores on the adhesion of YSZ debris to the tool surface significantly decreased, and the adhesion degree of YSZ debris first increased and then decreased. Increasing grinding loads and grinding speeds were correspondingly elevated the proportion of severe fracture and detachment of diamond grits. When the grinding load and grinding speed were 15 N and 1000 rpm respectively, the detachment proportion of diamond grits reached the highest. At this time, the proportion of micro-fracture, severe fracture and detachment of diamond grits was 35:37:28. The most critical factors influencing the material removal rate, grinding ratio, and YSZ surface roughness of porous Cu-Sn-Ti diamond tools were grinding speed, grinding load and grinding time, respectively. The porous Cu-Sn-Ti diamond tool was suitable for use under low load (3 N) and high speed (1000 rpm), achieving MRR, grinding ratio, and YSZ roughness of 26.44×10 -3 mm 3 /s, 42.30, and 3.34 μm, respectively. This work provides insights into the application of porous metal-based diamond tools under dry conditions.