Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu
Cu-Cu direct bonding using electroplated ultrafine-grain Cu (107.24 nm) was studied in air at 110-150 °C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125 °C, the Σ3 boundary length exceeded 40%, while below 120 °C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature-time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190 s as temperature increased.
Authors
- Chih‐En Hsu (ORCID: https://orcid.org/0000-0002-9974-8611)
- Lijun Yang (ORCID: https://orcid.org/0000-0002-4625-4028)
- Yun-Fong Lee
- Chih‐Li Lin (ORCID: https://orcid.org/0000-0003-4553-3727)
- Shifeng Pan (ORCID: https://orcid.org/0000-0001-7738-0708)
- Hsiao-Chi Hsieh (ORCID: https://orcid.org/0000-0002-4213-8580)
- Kwang‐Lung Lin (ORCID: https://orcid.org/0000-0003-4743-4765)
- Cheng‐Yi Liu (ORCID: https://orcid.org/0000-0002-0930-2609)
- Po‐Yu Chen (ORCID: https://orcid.org/0000-0002-0375-0718)
- Yu-Chen Huang (ORCID: https://orcid.org/0009-0002-0908-862X)
- W. T. Huang
- Yi‐Cheng Su
- Zhong-Yen Yu
- Mei‐Hsin Lo
- Jui-Sheng Chang
- Ting-Yi Cheng
- Chia-Hua Lin
- C. Y. Chiu
Institutions
- Tunghai University (TW)
- National Central University (TW)
Publication Details
- Journal
- Scientific Reports
- Published
- 2025-08-22
- DOI
- https://doi.org/10.1038/s41598-025-17058-2
- Primary Topic
- Copper Interconnects and Reliability
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Sun Yat-sen University
- Sun Yat-sen University