Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management

Miniaturized thermoelectric coolers, known for their high cooling power density and rapid thermal response, hold promise for localized thermal management. While traditional thermoelectric coolers have primarily relied on Bi<sub>2</sub>Te<sub>3</sub> alloys, the recent development of n-type Mg<sub>3</sub>Bi<sub>2</sub>-based materials presents a compelling alternative, offering enhanced cost-effectiveness and environmental sustainability. In this study, we have designed and fabricated a Mg<sub>3</sub>Bi<sub>2</sub>-based miniscale thermoelectric cooler. At the hot-side temperature of 300 K, the cooler achieves a maximum cooling temperature difference of ~59.0 K, a cooling power density of ~5.7 W cm<sup>-2</sup>, and a cooling speed of 65 K s<sup>-1</sup>, which surpasses the state-of-the-art Mg<sub>3</sub>Bi<sub>2</sub>-based devices. In addition, the miniaturized Mg<sub>3</sub>Bi<sub>2</sub>-based cooler maintains its cooling performance after cyclic electrical current density between 1 A mm<sup>-2</sup> and 3 A mm<sup>-2</sup> for approximately 3,000 cycles. Notably, this miniscale cooler has been applied to provide localized cooling for the central processing unit in a microcontroller. Our findings highlight the potential of Mg<sub>3</sub>Bi<sub>2</sub>-based miniscale coolers, offering new possibilities for localized thermal management in electronic devices.

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Publication Details

Journal
Nature Communications
Published
2025-08-20
DOI
https://doi.org/10.1038/s41467-025-63174-y
Citations
9
Primary Topic
Advanced Thermoelectric Materials and Devices
Type
article
Field-Weighted Citation Impact
4.66

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article

Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management

Jun Mao, Sichen Duan, Lifu Wu, Shizhen Zhi et al.
9 citations
Nature Communications
Advanced Thermoelectric Materials and Devices
4.66
article

Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management

Jun Mao, Sichen Duan, Lifu Wu, Shizhen Zhi, Chen Jiang, Chenhao Lin, Kun Liang, Feng Cao, Li Yin, Zunqian Tang, Yao Xu, Linlin Song, Sheng Ye, Feng Jiang, Jian Wang, Hengyu Yang, Xiaojing Ma, Peng Zhao, Zuoxu Wu, Jiamin Qiu, Qian Zhang
article en
9 citations

Abstract

Miniaturized thermoelectric coolers, known for their high cooling power density and rapid thermal response, hold promise for localized thermal management. While traditional thermoelectric coolers have primarily relied on Bi<sub>2</sub>Te<sub>3</sub> alloys, the recent development of n-type Mg<sub>3</sub>Bi<sub>2</sub>-based materials presents a compelling alternative, offering enhanced cost-effectiveness and environmental sustainability. In this study, we have designed and fabricated a Mg<sub>3</sub>Bi<sub>2</sub>-based miniscale thermoelectric cooler. At the hot-side temperature of 300 K, the cooler achieves a maximum cooling temperature difference of ~59.0 K, a cooling power density of ~5.7 W cm<sup>-2</sup>, and a cooling speed of 65 K s<sup>-1</sup>, which surpasses the state-of-the-art Mg<sub>3</sub>Bi<sub>2</sub>-based devices. In addition, the miniaturized Mg<sub>3</sub>Bi<sub>2</sub>-based cooler maintains its cooling performance after cyclic electrical current density between 1 A mm<sup>-2</sup> and 3 A mm<sup>-2</sup> for approximately 3,000 cycles. Notably, this miniscale cooler has been applied to provide localized cooling for the central processing unit in a microcontroller. Our findings highlight the potential of Mg<sub>3</sub>Bi<sub>2</sub>-based miniscale coolers, offering new possibilities for localized thermal management in electronic devices.

Nature CommunicationsVol. 16(1)
Shenzhen Institute of Information Technology (CN), Harbin Institute of Technology (CN), Shenzhen Research Institute of Big Data (CN), Ministry of Industry and Information Technology (CN)
National Natural Science Foundation of China, China Postdoctoral Science Foundation, Basic and Applied Basic Research Foundation of Guangdong Province
Affordable and clean energy
Openalex Percentile: Top 5%
Advanced Thermoelectric Materials and Devices
4.66
DOIOpen Access PDFOpenAlex
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