“HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARD TECHNOLOGY INNOVATIONS, APPLICATIONS AND FUTURE PROSPECTS”

High Density Interconnect (HDI) technology has transformed the landscape of microelectronics and PCB (Printed Circuit Board) design by enabling compact, high-performance systems through microvia, buried/blind via, and laser drilling technologies.It plays a pivotal role in 5G, automotive systems, aerospace, defense, and IoT.Innovation is driven by miniaturization, reliability demands, and multifunctional integration.Challenges remain in manufacturability, cost, and thermal management, but future prospects include hybrid bonding, stretchable electronics, and quantum/AI-integrated PCBs.