Micro-Machined Silicon for VCSEL-Based Transmitter with Direct RF Interfaces
We demonstrate a packaged optical transmitter with a GPPO interface on a micro-machined silicon interposer, achieving compact, high-speed connections between VCSEL and bias-T via flip-chip bonding, tested up to 25 GBaud PAM4 with 14.6 mW power consumption.
Authors
- Qingwei Mo
- Yueqi Zhao (ORCID: https://orcid.org/0000-0003-1867-8891)
- Chuanzhi Wang (ORCID: https://orcid.org/0000-0002-4428-950X)
- Jinsheng Xu (ORCID: https://orcid.org/0000-0001-5685-0942)
- Zhenzhen Wang (ORCID: https://orcid.org/0000-0003-3910-2517)
- Chenhui Li (ORCID: https://orcid.org/0000-0002-6172-602X)
- Jia Li (ORCID: https://orcid.org/0000-0002-9703-5546)
- Qian Zhang (ORCID: https://orcid.org/0009-0004-4339-4115)
Institutions
- ZTE (China) (CN)
- Zhejiang Lab (CN)
Publication Details
- Published
- 2025-06-29
- DOI
- https://doi.org/10.23919/oecc/psc62146.2025.11110240
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00