High-Speed EML and Packaging Technologies for GPU Cluster System

This paper presents the current development status of the EML chip, aiming to achieve 400 Gbps per lane, as well as the progress in packaging technologies, which are crucial for high-speed and high-density modules.

Authors

Takeo Fujita
Mizuki Shirao
Nobuo Ohata (ORCID: https://orcid.org/0000-0002-6446-7959)
T Nagamine
Shinya Okuda (ORCID: https://orcid.org/0000-0002-1444-9381)

Institutions

Mitsubishi Electric (Germany) (DE)
Mitsubishi Electric (Japan) (JP)

Publication Details

Published: 2025-06-29
DOI: https://doi.org/10.23919/oecc/psc62146.2025.11109359
Primary Topic: Copper Interconnects and Reliability
Type: article
Field-Weighted Citation Impact: 0.00

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article

High-Speed EML and Packaging Technologies for GPU Cluster System

Takeo Fujita, Mizuki Shirao, Nobuo Ohata, T Nagamine et al.

Jun 29, 2025

Copper Interconnects and Reliability

article

High-Speed EML and Packaging Technologies for GPU Cluster System

Takeo Fujita, Mizuki Shirao, Nobuo Ohata, T Nagamine, Shinya Okuda

June 29, 2025article en

Abstract

Mitsubishi Electric (Germany) (DE), Mitsubishi Electric (Japan) (JP)

Affordable and clean energy

Openalex Percentile: Top 87%

Copper Interconnects and Reliability

DOI Source OpenAlex

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High-Speed EML and Packaging Technologies for GPU Cluster System — Takeo Fujita, Mizuki Shirao, et al. · (2025) | TGRS Research Map | TGRS