Bistable In-Plane Switching by a Ni-Ti-Cu/Si Microactuator
This paper introduces a novel concept of in-plane bistable switching of a freely suspended Si platform using a co-integrated Ni-Ti-Cu/Si micro-actuator with large stroke. The microactuator consists of two coupled prestrained Ni-Ti-Cu/Si beams with nano-scale hinge dimensions, which are designed to exhibit buckling instability. By selective Joule heating, the one-way shape memory effect in the Ni-Ti-Cu layer results in a large shape recovery force allowing to switch between the stable states. First, we show the model-based design of the bistability range and switching force. Then, we present a process flow for co-integration onto a Si photonic chip for optical waveguide switching and demonstrate mechanical switching performance by in-situ experiments in a SEM.
Authors
- Alfred Ludwig (ORCID: https://orcid.org/0000-0003-2802-6774)
- E. Akbarnejad (ORCID: https://orcid.org/0000-0001-9089-5642)
- Gowtham Arivanandhan (ORCID: https://orcid.org/0000-0002-6176-5854)
- Manfred Kohl (ORCID: https://orcid.org/0000-0002-0597-4440)
Institutions
- Karlsruhe Institute of Technology (DE)
- Ruhr University Bochum (DE)
Publication Details
- Published
- 2025-06-29
- DOI
- https://doi.org/10.1109/transducers61432.2025.11110877
- Primary Topic
- Shape Memory Alloy Transformations
- Type
- article
- Field-Weighted Citation Impact
- 0.00