Toward a Self-Powered MM-Scale MEMS Sensor Platform through Heterogeneous Integration of SCUM and HV SOI CMOS

This work presents a novel, ultra-thin, multipurpose micro-electromechanical system (MEMS) sensor platform that integrates on-chip power, control, actuation, and sensing. Two silicon-on-insulator (SOI) wafers undergo thermocompression bonding (TCB) and substrate release to form an 80 μm thick device with no substrate consisting of two silicon device layers. MEMS devices on both the upper and lower SOI layers provide sensing and actuation for the platform, and solar cells formed with in-situ doping harvest power for the sensor platform. Optionally, integrated circuits can be attached to the platform through TCB to provide analog, digital, and other RF functionality. In this work, we describe the platform's fabrication process and characterize the performance of solar cells and SOI MEMS devices, such as mechanical joints and electrostatic motors. We then present an example of a fully integrated sensor system using the proposed platform.