Integration Methods for Co-Packaged Optics using Sin-to-Polymer Waveguide Coupling
We present broadband silicon-nitride to polymer waveguide adiabatic coupling interfaces with sub-1 dB loss around 1310 nm, validated using two integration methods: lithography and flip-chip bonding, achieving sub-2dB chip-to-chip and chip-to-fiber coupling loss. Keywords: Photonic integrated circuits, Photonics-Electronics integration, Packaging technology of photonic devices and circuits, Tapered and grating waveguides for optical coupling, Si photonic and heterogeneous platform, On-board optics and co-packaged optics for high-capacity interconnects
Authors
- Rafal Magdziak
- Jeroen Missinne (ORCID: https://orcid.org/0000-0002-3470-620X)
- Geert Van Steenberge (ORCID: https://orcid.org/0000-0001-8574-1235)
- Hakim Kobbi
- Arnita Podpod
- Filippo Ferraro (ORCID: https://orcid.org/0000-0002-9328-5548)
- Jef Van Asch (ORCID: https://orcid.org/0000-0002-0784-1131)
- Negin Golshani
- Dieter Bode
- Hüseyin Şar (ORCID: https://orcid.org/0000-0002-4993-1258)
- Joris Van Campenhout (ORCID: https://orcid.org/0000-0003-0778-2669)
- Swetanshu Bipul (ORCID: https://orcid.org/0000-0002-2701-8505)
- Junwen He (ORCID: https://orcid.org/0009-0002-9462-0077)
- Guy Lepage
- Yoojin Ban (ORCID: https://orcid.org/0000-0001-7319-8132)
Institutions
- Imec the Netherlands (NL)
- Ghent University (BE)
- IMEC (BE)
Publication Details
- Published
- 2025-06-29
- DOI
- https://doi.org/10.23919/oecc/psc62146.2025.11110865
- Primary Topic
- Semiconductor Lasers and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- European Commission
- HORIZON EUROPE Framework Programme