Mass-Production-Friendly Design and Manufacturing for 100-Gb/s-Pam4-Eml Using Single Butt-Joint Regrowth of Ingaaspmqws and Optimized ar Coating
We developed mass-production-friendly 100-Gb/s-PAM4-EMLs with a ridge waveguide structure, single butt-joint InGaAsP-MQW regrowth, and optimized AR coating, achieving 54 GHz bandwidth and TDECQ below 3.0 dB across <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$20-70^{\circ} \mathrm{C}$</tex>.
Authors
- Kuo‐How Huang (ORCID: https://orcid.org/0000-0002-0989-0578)
- Ming Yu (ORCID: https://orcid.org/0000-0001-7080-167X)
- Weizhong Sun (ORCID: https://orcid.org/0000-0003-0822-3367)
- Kaifeng Yang (ORCID: https://orcid.org/0000-0002-2416-2982)
- Y L Zhang (ORCID: https://orcid.org/0009-0003-7441-4687)
- Gao Chen (ORCID: https://orcid.org/0000-0001-6862-5638)
- Bin Liu (ORCID: https://orcid.org/0000-0002-6581-780X)
- Chang Gao (ORCID: https://orcid.org/0000-0002-1207-7457)
- Jian Fang (ORCID: https://orcid.org/0009-0001-9260-1879)
Institutions
- ON Semiconductor (United States) (US)
Publication Details
- Published
- 2025-06-29
- DOI
- https://doi.org/10.23919/oecc/psc62146.2025.11111315
- Citations
- 1
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.73