Stacked and Interleaved DSCM Architectures for Bi-Directional 100G/200G Coherent Pons With Back-Reflection Resilience
This paper investigates advanced stacked and interleaved DSCM architectures for 100G and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$200 G$</tex> coherent-PONs, achieving single wavelength bi-directional transmissions with low backreflection. Spectral efficiency is optimized via comparative analysis of subcarrier spacing and roll-off factors.
Authors
- Adrian A. Juarez (ORCID: https://orcid.org/0000-0002-3664-8998)
- Xin Chen (ORCID: https://orcid.org/0000-0002-2057-3733)
- Ming-Jun Li (ORCID: https://orcid.org/0000-0003-4141-6670)
- Haipeng Zhang (ORCID: https://orcid.org/0000-0001-9915-5210)
- Zhensheng Jia (ORCID: https://orcid.org/0000-0002-4559-1890)
Institutions
- Corning (United States) (US)
- Cablevision (United States) (US)
Publication Details
- Published
- 2025-06-29
- DOI
- https://doi.org/10.23919/oecc/psc62146.2025.11110539
- Primary Topic
- Integrated Circuits and Semiconductor Failure Analysis
- Type
- article
- Field-Weighted Citation Impact
- 0.00