Reactive Bonding by the use of Nanolayer Stacks on LTCC Substrates
The study focuses on the application of reactive multilayers in the area of LTCC technology. In order to widen the technological pathways in fabricating heterogeneous microsystems, the paper studies the use of reactive foil for the bonding of two LTCC substrates to each other. Different bonding forces of 0 N and 100 N are compared to each other at a fixed preheat temperature of $160^{\circ} \mathrm{C}$. The results of the reactive bonding experiments were analyzed by scanning electron microscopy and EDX of cross sections, to understand the metallurgical reactions during the bonding process.
Authors
- Erik Wiss (ORCID: https://orcid.org/0000-0001-7036-1547)
- Steffen Wiese (ORCID: https://orcid.org/0000-0002-0735-865X)
- Jens Müller (ORCID: https://orcid.org/0009-0001-1168-3666)
- Nesrine Jaziri (ORCID: https://orcid.org/0000-0002-0244-6482)
Institutions
- Technische Universität Ilmenau (DE)
- Fraunhofer Institute for Reliability and Microintegration (DE)
Publication Details
- Published
- 2025-05-14
- DOI
- https://doi.org/10.1109/isse65583.2025.11121003
- Primary Topic
- Electrical and Thermal Properties of Materials
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- Deutsche Forschungsgemeinschaft