International Collaborative Hands-on Activities on Advanced Electronics and Photonics for Higher Education Using 3D Printing Techniques

This paper proposes a new educational pathway for international teaching and learning on advanced engineering technologies in the field of electronics and photonics. It explores integration of three-dimensional printing (3DP) techniques into university education to foster students’ skills in advanced and sustainable engineering. Based on the results from a literature review and the survey performed among students and teachers at three European universities, we developed the program for the international hands-on activities to promote 3DP tools in teaching and learning on advanced technologies in electronics and photonics. These courses include a pilot hybrid teaching activity with online lectures and on-site training as a pre-test event for preparing the summer school.