Characterization of Solder Flux by Synergic Combination of Gas Chromatography Coupled to Mass Spectrometry and Fourier-Transform Infrared Spectroscopy

The characterization of solder flux systems presents significant analytical challenges that require sophisticated techniques to fully understand their chemical composition, thermal behavior, and potential effects on electronic assemblies. This paper explores how the synergic combination of Gas Chromatography coupled to Mass Spectrometry (GC-MS) with Fourier-Transform Infrared Spectroscopy (FTIR) creates a powerful analytical approach for comprehensive flux characterization. Five samples with various flux chemistries were thoroughly analyzed. These complementary techniques allowed for detailed identification of flux components, their volatility, and evaluation of residue formation-critical factors in ensuring reliability in electronics manufacturing. We demonstrate that combining these methods provides insights not possible through individual analytical approaches alone, particularly for understanding the complex chemistries involved in no-clean flux systems and their potential impacts on long-term electronic component reliability. When these techniques are coupled, researchers can determine what compounds are present in flux formulations and at what temperatures they evaporate, decompose, or transform, providing critical insights for process optimization and reliability prediction.

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Published
2025-05-14
DOI
https://doi.org/10.1109/isse65583.2025.11121047
Primary Topic
Electronic Packaging and Soldering Technologies
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article
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article

Characterization of Solder Flux by Synergic Combination of Gas Chromatography Coupled to Mass Spectrometry and Fourier-Transform Infrared Spectroscopy

Dominik Pilnaj, Petr Veselý, Jonáš Uřičář, Karel Dušek
Electronic Packaging and Soldering Technologies
article

Characterization of Solder Flux by Synergic Combination of Gas Chromatography Coupled to Mass Spectrometry and Fourier-Transform Infrared Spectroscopy

Dominik Pilnaj, Petr Veselý, Jonáš Uřičář, Karel Dušek
article en

Abstract

The characterization of solder flux systems presents significant analytical challenges that require sophisticated techniques to fully understand their chemical composition, thermal behavior, and potential effects on electronic assemblies. This paper explores how the synergic combination of Gas Chromatography coupled to Mass Spectrometry (GC-MS) with Fourier-Transform Infrared Spectroscopy (FTIR) creates a powerful analytical approach for comprehensive flux characterization. Five samples with various flux chemistries were thoroughly analyzed. These complementary techniques allowed for detailed identification of flux components, their volatility, and evaluation of residue formation-critical factors in ensuring reliability in electronics manufacturing. We demonstrate that combining these methods provides insights not possible through individual analytical approaches alone, particularly for understanding the complex chemistries involved in no-clean flux systems and their potential impacts on long-term electronic component reliability. When these techniques are coupled, researchers can determine what compounds are present in flux formulations and at what temperatures they evaporate, decompose, or transform, providing critical insights for process optimization and reliability prediction.

Czech Technical University in Prague (CZ)
Affordable and clean energy
Openalex Percentile: Top 80%
Electronic Packaging and Soldering Technologies
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Characterization of Solder Flux by Synergic Combination of Gas Chromatography Coupled to Mass Spectrometry and Fourier-Transform Infrared Spectroscopy — Dominik Pilnaj, Petr Veselý, et al. · (2025) | TGRS Research Map | TGRS