Advancements in Miniaturization of High-Aspect Ratio Through Ceramic Microvias (TCμV) for High-Density Interconnect LTCC Interposer

The miniaturization of microvias for high-density interconnect (HDI) for high-performance and reliable microelectronics is a critical area of development in the electronics and semiconductor industries. As the size of electronic devices decreases and their functionality rises, the need for smaller, more efficient interconnects from chip to carrier sides grows tremendously. Microvias, used for vertical interconnection of layers in multilayer substrates, are essential for high-performance systems that demand compact and reliable connections. This study focuses on developing highaspect ratio through ceramic microvias ($\mathrm{TC} \mu \mathrm{V}$) lower than $20 \mu \mathrm{~m}$ for HDI ceramic interposers. The study includes materials investigation and their suitability for the fabrication of $\mathrm{TC} \mu \mathrm{V}$ and reliability testing through electrical measurements and optical inspections. The conducted study results in achieving Au-based TC $\boldsymbol{\mu} \mathbf{V}$ with diameter down to $\mathbf{6} \boldsymbol{\mu} \mathbf{m}$.