Mitigating TPA-Induced Instability in III-V/Si Hybrid Laser via Reverse-Biased PIN Junctions

We demonstrate a III-V/Si external cavity laser incorporating PIN junctions within silicon microring resonators. By sweeping the TPA-induced carriers using reverse PIN junction, the laser exhibits superior performance compared with its unbiased counterpart.

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Published
2025-06-29
DOI
https://doi.org/10.23919/oecc/psc62146.2025.11109361
Primary Topic
Integrated Circuits and Semiconductor Failure Analysis
Type
article
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article

Mitigating TPA-Induced Instability in III-V/Si Hybrid Laser via Reverse-Biased PIN Junctions

Weihan Xu, Linjie Zhou, Yihao Fan, E Siyu et al.
5 links
Integrated Circuits and Semiconductor Failure Analysis
article

Mitigating TPA-Induced Instability in III-V/Si Hybrid Laser via Reverse-Biased PIN Junctions

Weihan Xu, Linjie Zhou, Yihao Fan, E Siyu, Minhui Jin, Yuyao Guo, Li Yu, Xinhang Li, Jianping Chen, Liangjun Lu
article en

Abstract

We demonstrate a III-V/Si external cavity laser incorporating PIN junctions within silicon microring resonators. By sweeping the TPA-induced carriers using reverse PIN junction, the laser exhibits superior performance compared with its unbiased counterpart.

Shanghai Jiao Tong University (CN)
National Natural Science Foundation of China, National Key Research and Development Program of China
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Openalex Percentile: Top 80%
Integrated Circuits and Semiconductor Failure Analysis
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