Development of a New Ceramic Package Design for Special Applications

This paper deals with the creation of a custom sealed ceramic package. It also optimizes the process of its creation using a combination of glass solder and lead-free solder. Glass solder is used for joining multiple layers of alumina ceramic (Al2O3) to create a cavity for the die. Lead free solder is then used in combination with thick film printing to enclose the cavity while not exceeding the maximum temperature of the die. With proper process optimization this package is capable of being hermetically sealed.