Study on the Impact of Component Placement on the Thermal Performance of a Power Electronic Board

As technology evolves, advanced applications place increasing demands on Light Emitting Diodes (LEDs), necessitating improved thermal management to address the growing heat flux density. This paper focuses on conducting thermal measurements in a high-power LED system to analyze its thermal performance and management. The study focuses on varying the placement of the components on the Printed Circuit Board (PCB), proving that there is a clear influence of component placement on temperature distribution. Three PCBs are designed and produced, having different placement strategies and thermal images are taken with a thermal imaging camera. Results show that the maximum temperature values the components reach, as well as the temperature distribution on the PCB surface is influenced by the component placement.