Converging Methods of 2.5-D Heterogeneous Integration Based on Multiple Substrates

Physical limitations to Dennard and Moore scaling are being encountered in the development of advanced device and circuit technologies. This challenge has promoted heterogeneous integration (HI) as a method to enable tighter logic-memory coupling and application-specific architectures through 2.5D/3D packaging. While silicon remains the dominant interposer material, growing interest in alternative substrates such as organic, glass, and ceramic interposers highlights the need for more versatile, substrate-independent HI methods due to thermal, mechanical, and processing limitations in non-silicon materials. This work introduces a modular HI approach using self-aligned wafer level integration technology (SAWLIT) to embed commercial chiplets into various substrates, eg, aluminum nitride, borosilicate glass and PET. All three substrates maintained electrical functionality within manufacturer tolerances for the embedded chiplets, demonstrating the feasibility of substrate-independent integration approaches.