Heat-Isolated Organic Field-Effect Transistors With Strong Electrostatic Discharge Tolerance

Organic field-effect transistors (OFETs) that are intrinsically flexible are desirable components for wearable electronics. A major challenge for these electronics is electrostatic discharge (ESD) from the human body, which can release ampere-level current surges and generate significant heat dissipation. As the molecular packing and the charge transport of the organic semiconductors are susceptible to temperature variation, especially to high temperatures, OFETs are generally vulnerable to ESD failure. Here, we report a heat-isolated OFET (hiOFET) with improved ESD tolerance by dispersing ESD current paths and isolating heat dissipation regions in the device. Our strategy realized the device failure level of up to 55.03 mA/mm, which was nearly 1.7 times higher than that of conventional transistor geometry. Moreover, the universality of this strategy was validated on various conjugated polymers.

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Publication Details

Journal
IEEE Transactions on Electron Devices
Published
2025-08-18
DOI
https://doi.org/10.1109/ted.2025.3598752
Primary Topic
Advanced Memory and Neural Computing
Type
article
Field-Weighted Citation Impact
0.00

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article

Heat-Isolated Organic Field-Effect Transistors With Strong Electrostatic Discharge Tolerance

Yuan Wang, Yu‐Qing Zheng, Zeyu Zhong, Yang Wang et al.
IEEE Transactions on Electron Devices
Advanced Memory and Neural Computing
article

Heat-Isolated Organic Field-Effect Transistors With Strong Electrostatic Discharge Tolerance

Yuan Wang, Yu‐Qing Zheng, Zeyu Zhong, Yang Wang, Zhanpeng Cui
article en

Abstract

Organic field-effect transistors (OFETs) that are intrinsically flexible are desirable components for wearable electronics. A major challenge for these electronics is electrostatic discharge (ESD) from the human body, which can release ampere-level current surges and generate significant heat dissipation. As the molecular packing and the charge transport of the organic semiconductors are susceptible to temperature variation, especially to high temperatures, OFETs are generally vulnerable to ESD failure. Here, we report a heat-isolated OFET (hiOFET) with improved ESD tolerance by dispersing ESD current paths and isolating heat dissipation regions in the device. Our strategy realized the device failure level of up to 55.03 mA/mm, which was nearly 1.7 times higher than that of conventional transistor geometry. Moreover, the universality of this strategy was validated on various conjugated polymers.

IEEE Transactions on Electron DevicesVol. 72(10)
Peking University (CN), Nanjing University of Posts and Telecommunications (CN)
Fundamental Research Funds for the Central Universities
Affordable and clean energy
Openalex Percentile: Top 80%
Advanced Memory and Neural Computing
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