A 20-Year Retrospective on Power and Thermal Modeling and Management
Editor’s notes: The authors review research on power and thermal modeling and management in processors, addressing the challenges posed by rising power densities and complex thermal effects. The article also categorizes dynamic runtime strategies that optimize the tradeoffs between performance, energy efficiency, and reliability. Emerging challenges and future research directions are highlighted. —Jörg Henkel, Vice-President of Publications, IEEE CEDA —L. Miguel Silveira, President, IEEE CEDA
Authors
- Luis Costero (ORCID: https://orcid.org/0000-0002-6922-2520)
- David Atienza (ORCID: https://orcid.org/0000-0001-9536-4947)
- Kai Zhu (ORCID: https://orcid.org/0000-0003-4708-091X)
- Darong Huang (ORCID: https://orcid.org/0000-0002-6579-0627)
Institutions
- Universidad Complutense de Madrid (ES)
- École Polytechnique Fédérale de Lausanne (CH)
Publication Details
- Journal
- IEEE Design and Test
- Published
- 2025-08-13
- DOI
- https://doi.org/10.1109/mdat.2025.3597956
- Citations
- 1
- Primary Topic
- Thermal Analysis in Power Transmission
- Type
- article
- Field-Weighted Citation Impact
- 1.21