Thermal Field Simulation and Influencing Factor Analysis of 10kV Three-Core Cable Joint
Abstract With the rapid development of China’s economy and technological advancements, the scale of power distribution cables has expanded significantly, while overheating at cable joints has emerged as a critical threat to grid safety. Existing research on three-core cable joints remains limited, often relying on simplified geometric models that neglect non-cylindrical structural features in practical joints. This study focuses on a 10kV three-core cable intermediate joint, establishing a refined three-dimensional finite element model that incorporates realistic joint geometry and contact resistance at crimping interfaces. Through thermal field simulations, the influence mechanisms of key parameters—including crimp coefficients, conductor current, ambient temperature, and convective heat transfer coefficient—on temperature distribution were systematically investigated. The results show that: (1) When the crimp coefficient exceeds 3, the conductor core temperature at the joint becomes significantly higher than that at the cable body; (2) Increasing the conductor current leads to a notable temperature rise, with localized hotspots observed in poorly crimped regions; (3) Elevated ambient temperatures or reduced convective heat transfer coefficients significantly exacerbate conductor core heating. This study elucidates the temperature distribution patterns and influencing factors in three-core cable joints, providing critical theoretical support for the reliability-oriented design and operational maintenance of power distribution cable systems. The findings offer practical guidance for optimizing crimping processes, mitigating thermal risks, and enhancing grid stability.
Authors
- Yujing Sun (ORCID: https://orcid.org/0000-0002-5201-3511)
- Zhanhua Huang (ORCID: https://orcid.org/0000-0001-7933-932X)
- Ran Hu (ORCID: https://orcid.org/0000-0001-5068-8833)
- Jiahao Wen (ORCID: https://orcid.org/0000-0003-3774-0830)
- Jiangtao Li (ORCID: https://orcid.org/0000-0003-2995-4759)
- Chen Chen (ORCID: https://orcid.org/0000-0002-6347-8832)
- Bing Li (ORCID: https://orcid.org/0000-0001-7592-1515)
- H. L. Dai (ORCID: https://orcid.org/0000-0002-8312-7650)
Institutions
- Shenzhen Stock Exchange (CN)
- Xi'an Jiaotong University (CN)
Publication Details
- Journal
- Journal of Physics Conference Series
- Published
- 2025-08-01
- DOI
- https://doi.org/10.1088/1742-6596/3074/1/012017
- Primary Topic
- Thermal Analysis in Power Transmission
- Type
- article
- Field-Weighted Citation Impact
- 0.00