Effect of Cu and Ag Content on the Electrochemical Performance of Fe40Al Intermetallic Alloy in Artificial Saliva

This study investigates the effect of copper (Cu) and silver (Ag) additions on the electrochemical behavior of the Fe40Al intermetallic alloy in artificial saliva, aiming to evaluate its potential for biomedical applications such as dental implants. Alloys with varying concentrations of Ag (0.5, 1.0, and 3.0 wt%) and Cu (1.0, 3.0, and 5.0 wt%) were synthesized and exposed to a biomimetic electrolyte simulating oral conditions. Electrochemical techniques, including open circuit potential (OCP), linear polarization resistance (LPR), potentiodynamic polarization, and electrochemical impedance spectroscopy (EIS), were employed to assess corrosion performance. Results show that unmodified Fe40Al exhibits good corrosion resistance, attributed to the formation of a stable passive oxide layer. The addition of Cu, particularly at 3.0 wt%, significantly improved corrosion resistance, yielding lower corrosion current densities and higher polarization resistance and charge transfer resistance values, surpassing even 316L stainless steel in some metrics. Conversely, Ag additions led to a degradation of corrosion resistance, especially at 3.0 wt%, due to microstructural changes and the formation of metallic Ag precipitates, AgSCN, and galvanic cells, which promoted localized corrosion. EIS results revealed that Cu- and Ag-modified alloys developed less homogeneous and less protective passive layers over time, as indicated by increased double-layer capacitance (Cdl) and reduced constant phase element exponent (ndl) values. Overall, the Fe40Al alloy shows intrinsic corrosion resistance in simulated physiological environments, and Cu additions can enhance this performance under controlled conditions. However, Ag additions negatively affect the protective behavior of the passive layer. These findings offer critical insight into the design of Fe-Al-based biomaterials for dental or biomedical applications where corrosion resistance and electrochemical stability are paramount.