Overcoming Mobility-Stability Trade-off by Gate Stack Engineering in BEOL Compatible Ga Doped In<sub>2</sub>O<sub>3</sub> MOSFETs

Indium oxide (In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>)-based thin-film transistors (TFTs) exhibit a trade-off between carrier mobility and device reliability. This arises because oxygen vacancies ($\mathrm{V}_{\mathrm{O}}$) act as shallow donors that boost carrier concentrations and set the Fermi level above the mobility edge, but their propensity to form under bias and temperature stress compromises reliability [1]. To suppress $\mathrm{V}_{\mathrm{o}}$ formation, cations featuring high metal-oxygen bonddissociation energies (M-O BDE), such as tungsten [2–4] gallium [5], are often employed; however, achieving effective suppression requires substantial doping. Such high doping levels significantly degrade the intrinsic high mobility of In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> by enhancing electron scattering. In this study, the inherent tradeoff between mobility and threshold voltage stability is mitigated (Fig1. (a-c)) by using engineered gate stacks composed of HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> and Al<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> in a hybrid configuration. These gate stacks are integrated into back-gated (BG) gallium-doped In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> MOSFET test vehicles and displayed smaller threshold voltage shifts ($\Delta \mathrm{V}_{\mathrm{T}}$) under both positive and negative bias stress (PBS and NBS) relative to conventional devices employing HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>-only gate stacks.

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Published
2025-06-22
DOI
https://doi.org/10.1109/drc66027.2025.11105741
Primary Topic
ZnO doping and properties
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article
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article

Overcoming Mobility-Stability Trade-off by Gate Stack Engineering in BEOL Compatible Ga Doped In2O3 MOSFETs

Hyeonwoo Park, Eknath Sarkar, Suman Datta, Dyutimoy Chakraborty et al.
ZnO doping and properties
article

Overcoming Mobility-Stability Trade-off by Gate Stack Engineering in BEOL Compatible Ga Doped In2O3 MOSFETs

Hyeonwoo Park, Eknath Sarkar, Suman Datta, Dyutimoy Chakraborty, Asif Islam Khan, Mengkun Tian, Hyun Jae Lee, Chengyang Zhang, Emmanuel Quezada
article en

Abstract

Indium oxide (In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf>)-based thin-film transistors (TFTs) exhibit a trade-off between carrier mobility and device reliability. This arises because oxygen vacancies ($\mathrm{V}_{\mathrm{O}}$) act as shallow donors that boost carrier concentrations and set the Fermi level above the mobility edge, but their propensity to form under bias and temperature stress compromises reliability [1]. To suppress $\mathrm{V}_{\mathrm{o}}$ formation, cations featuring high metal-oxygen bonddissociation energies (M-O BDE), such as tungsten [2–4] gallium [5], are often employed; however, achieving effective suppression requires substantial doping. Such high doping levels significantly degrade the intrinsic high mobility of In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> by enhancing electron scattering. In this study, the inherent tradeoff between mobility and threshold voltage stability is mitigated (Fig1. (a-c)) by using engineered gate stacks composed of HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> and Al<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> in a hybrid configuration. These gate stacks are integrated into back-gated (BG) gallium-doped In<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>O<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> MOSFET test vehicles and displayed smaller threshold voltage shifts ($\Delta \mathrm{V}_{\mathrm{T}}$) under both positive and negative bias stress (PBS and NBS) relative to conventional devices employing HfO<inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf>-only gate stacks.

Georgia Institute of Technology (US)
Openalex Percentile: Top 85%
ZnO doping and properties
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