Electronic Design and Modal Analysis of Inertial Measurement Unit for UAV Missions

Unmanned Aerial Vehicles (UAVs) consist of diverse electronic and mechanical subsystems, with electronic subsystems commonly implemented on printed circuit boards (PCBs) housed within mechanical enclosures. These PCBs incorporate essential components such as sensors, power circuits, and modules for signal adaptation and conditioning, forming the backbone of the embedded system. UAVs are subject to various mechanical loads during operation, including shocks, vibrations, and acoustic stresses. Gaining a comprehensive understanding of the dynamic behavior of these systems is essential for design engineers to optimize mechanical structures, fine-tune embedded system specifications, and improve durability under extreme vibrational conditions.The development of a PCB for a drone represents a pivotal step in creating lightweight and efficient embedded systems that adhere to stringent robustness and reliability standards. This work integrates key phases, ranging from the electronic design for the inertial meeasurement unit to the structural and vibrational analysis of the board, ensuring optimal performance and resilience in challenging operational environments.