Numerical study of contact heat transfer characteristics at solid-solid interface of soft/hard elastomer

Abstract This article investigates the contact heat transfer mechanism between copper and thermal pads. Based on the three-dimensional multi-physics field coupling numerical model of the steady-state heat flux method, the multi-parameter coupling mechanism of pressure load, interface thermal conductivity, and surface morphology is systematically revealed. By means of numerical simulation, The coordinated analysis of the genuine contact area across the interface and the von Mises stress field under steady-state conditions is achieved. The simulation results demonstrate a strong negative correlation between the interface thermal contact resistance and the real contact zone, and its evolution process is controlled by the dynamic balance of pressure, thermal conductivity, and roughness. It provides theoretical support for the optimization of the gradient pressure assembly process of related electronic devices.